This question is in regards to Dell 11th generation hardware that have 4 embedded interfaces (e.g. R610, R710, R810) running RHEL 5 and RHEL 6 servers. We normally run these in an active/passive mode (sometimes we use link aggregation when needed) - what I'd like to know is, is there a formal document and/or whitepaper on channel bonding best practices? For example, is it better to bond the first and second interface, or is there a performance improvement by bonding on the first and third interface. There might be a spec sheet on this - not sure - hoping that someone else has this information.
Thanks in advanced.
Drew